The TechPack Conference at PaperWeek

TechPack is PaperWeek’s dedicated segment of the Paperboard Packaging Industry. With experts covering the latest technology advancements and market updates in the sector, the presentations will also provide updates on some of the most recent implementations & projects that have made the news in the packaging industry.
TechPack Conference Program
Wednesday, February 15
8:30 - 10:00
TECHPACK CONFERENCE KICK OFF
Room: Level 4 - Ballroom West
8:30
''Next Generation of Recycled Linerboard''
Mike Lafave, Senior Vice President & COO, Containerboard/Packaging & Recycling, Kruger
9:00
''What the recent 2016 US Election will mean for the North American Containerboard/Corrugated industry''
Donna Harman, President, AF& PA
9:30
''Sustainable, green packaging – advancements, trends, market perspectives – cutting through the greenwash!''
John Mullinder, Executive Director, PPEC

Mike Lafave

Donna Harman

John Mullinder
10:30 - 12:00
MARKET
Room: Level 2 - Salon 2
10:30
''Fire protection in the OCC yard''
Achim Hering, Cogeco
11:00
''OCC quality update''
Marco Pescantin, Quattro Paper
11:30
''ClO2 Generator Safety Systems''
Rick Wasson, Irving
13:30 - 15:00
Most recent R&D Advancements in Packaging
Room: Level 2 - Salon 2
13:30
''Food packaging R&D: Making of hygienic paper and board grades for food-packaging. Trends, challenges and solutions observed in the making of hygienic grades''
Ken Keegan, Kemira
14:15
''Paperboard Science update: Trends and technology advancements in Paperboard Packaging – an Overview''
Xuejun Zou, FPInnovations
15:30 - 17:00
Process/Technology
Room: Level 2 - Salon 2
15:30
''Chemical strength enhancement (Enzymes) vs mechanical refining''
Kevin MacDonald, Buckman
15:50
''Wet felt conditioning improvement''
Daniel Hédou, AstenJohnson
16:10
''Case studies in runnability rebuild projects''
Lawrence Yane, Enerquin Air
16:30
''OCC detrashing technology''
Neale Fetterly, Kadant

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